Nanotherm PCM+ - "The after effects raises questions"

 

FINAL UPDATE:

Edit: Upon further examination, it appears to me that the Nanotherm "version 2" of the PCM+ serves the same purpose without any notable difference. My findings will be documented in the forthcoming review of the version 2 product. However, I must emphasize that the decision to use it or not ultimately rests with you. Based on my research, I strongly advise against its usage, except for aluminum heatsinks. For copper heatsinks, I recommend opting for Arctic Silver Ceramique or Arctic Silver 5.

Similar issues can be found on forums such as overclockers.com and hardocp, where tests have yielded consistent results.

Has Nanotherm taken any steps to address these concerns? Yes, they have. Nanotherm is undeniably making a comeback by soon introducing new products featuring advanced corrosion inhibitors. Please refer to the press releases provided at the end of this message for more details. These products will serve as a preparatory measure prior to using the PCM+ or any other thermal interface material (TIM). Nanotherm claims to have already released an enhanced version of the PCM+ with an anti-corrosion formula incorporated into it, minimizing the risk of oxidation when in contact with copper. Furthermore, Nanotherm is also launching a standalone corrosion inhibitor product, designed for final cleaning and surface treatment after lapping and before applying thermal compound—regardless of the chosen TIM. Nanotherm has been actively addressing these concerns and taking proactive measures.

So, what does all of this mean? Nanotherm will be introducing new products to prevent such incidents in the future, along with an improved PCM+ formulation containing a corrosion inhibitor. They are incorporating new surface preparation methods, enabling users to prepare their heat sink assembly before applying any thermal compound—a commendable move indeed.

Considering the new formula, ease of installation, and the excellent performance demonstrated in the review, I highly recommend considering the newly formulated PCM+.

This responsiveness by Nanotherm in listening to customer feedback and taking corrective action speaks volumes about their commitment to quality. With the introduction of new steps and a reformulated formula, this issue has been laid to rest. Consequently, I firmly conclude that Nanotherm PCM+ (with the new formula) remains the thermal compound of choice. Rest assured, Nanotherm PCM+ is safe to use.

In terms of future improvements, I believe Nanotherm would greatly benefit from conducting thorough and long-term testing on their compounds.

Finally, I have been asked on numerous occasions why I decided to publish this article. The answer is simple: incidents like these should not occur. By bringing attention to this issue, I felt a responsibility towards myself and the readers to address it. Ignoring the problem would have been unfair. Through my research on various forums, I discovered that others have experienced similar issues but remained unaware of the cause, dismissing it as normal. No one appreciates a thermal compound that causes oxidation on their cooler, wouldn't you agree? While there may have been negative consequences, the positive aspect is that Nanotherm has demonstrated excellence in customer engagement and commitment to product quality. To resolve this problem, they are releasing new products featuring advanced corrosion inhibitors, benefiting everyone. Any negative publicity can be overcome and rewritten over time.

Press Release on new products:

"New and Improved" Nanotherm PCM+, New Nanotherm Products and Soon-to-be-Released Products

- New and Improved Nanotherm PCM+ : We have recently completed the formulation of our "new and improved" Nanotherm PCM+, which now includes an advanced "all metal" corrosion inhibitor" package to protect the mating metal heat transfer surfaces on aluminum and copper HSFs and Waterblocks from oxidation and corrosion. The Nanotherm PCM+ is the first (and only) thermal interface material to include advanced, "all metal" (both ferrous and non-ferrous), multi-duty corrosion inhibitors that protect not only against flash corrosion, but provide contact corrosion and vapor corrosion protection, as well. All this with the same outstanding material characteristics and superior thermal performance as the original Nanotherm PCM+ formulation

- Lapping Kits - There are 2 kits. The Standard Lapping Kit includes 8 different grits of Wet-or-Dry sandpaper in 4.5" x 5.5" sheets in 400, 600, 800, 1000, 1200, 1500, 2000 and 2500 grit. The Deluxe Lapping Kit includes the same 8 sheets / grits of sandpaper and also includes a "bullet proof" 6" x 6" square of .250" thick, flat polycarbonate Lapping Surface.

- New Lapping Fluid / TIM Remover and Surface Cleaner Products with Advanced Corrosion Inhibitors - We're all over this corrosion inhibitor stuff! Yes, we have other new products that contain these wonderful new environmentally-safe corrosion-inhibitor products that work synergistically with, compliment and enhance our current line of thermal interface materials and our new Lapping Kit, as well.

They will also enhance further enhance your revenues and profitability, as they are unique products in their own right. The first is our soon-to-be-released citrus-based Lapping Fluid & TIM Remover, which, of course, contains corrosion inhibitors to prevent flash corrosion during the Lapping process. The 2nd (sister) product is our upcoming Lapped Surface Cleaner product with flash and contact corrosion inhibitors that not only cleans and protects surfaces - it leaves Zero Residue. We're refining and testing the final formulations of these products and expect to have them available within the next 2 - 3 weeks to compliment the Lapping Kits.

We're also working on a unique new Heat Transfer Fluid and Water Cooling Kit which we hope to have available by early December.

 

Update 3: I have received a response from Scott, who has reached out to others that have used PCM+ and found that they did not encounter similar issues. Scott raised a question about the use of alcohol when cleaning the die, suggesting that using 91% or better alcohol may contribute to the discoloration problem. It's worth noting that I personally use Akasa TIM Clean instead of alcohol. Scott also mentioned that the compound should not react with copper.

Interestingly, Scott shared a new theory proposed by a friend who is a Computer Engineer, and it seems we may be onto something. According to the Computer Engineer, most manufacturers of copper heatsinks apply a thin coating of lacquer or another sealant to prevent copper from reacting with oxygen and forming the commonly observed "green facia" or weathering. This protective coating ensures optimal thermal conductivity by safeguarding the copper from oxidation. However, it is plausible that these lacquers or sealants chemically interact with the compounds used in Nanotherm's PCM. Furthermore, this reaction might only occur when heat is applied, explaining why the discoloration is observed specifically where the CPU comes into contact with the surface. This theory holds promise as a potential culprit behind the issue and warrants further testing.

More investigation is required to validate this hypothesis and gather additional evidence.

I suggest looking here because it doesn't seem to be just me. 

I am more determined than ever to pursue this issue for the benefit of the people involved. Based on information from a reliable source who is a computer engineer, continued oxidation, which manifests as burn marks, can potentially lead to significant long-term consequences. It is evident that the oxidation is occurring precisely at the point where the CPU die and heatsink make contact. Copper Oxide, being approximately ten times less thermally conductive than Copper, can directly contribute to CPU thermal failure and pose challenges when attempting to remove it without causing damage to either the CPU or the heatsink.

Although I am aware that heat promotes oxidation over time, the rate at which this oxidation occurred was significantly accelerated. Even the cooler I recently tested just four days ago exhibited similar effects, with observable formation in the same manner. I am currently in the process of testing an aluminum cooler with PCM+ as well. Considering these circumstances, I recommend that Nanotherm conducts further long-term testing if they haven't done so already. I have used various other silver compounds such as Nanotherm Blue II, XTC, Arctic Silver 3, and Ceramique on this cooler and others without encountering this oxidation issue. The oxidation seemed to occur suddenly and unexpectedly.

Allow me to provide a detailed account of the steps I took that led to this oxidation:

Prior to applying the compound, I always clean the CPU die using a soft tissue paper, ensuring any lint is removed beforehand. I employ Akasa TIM Clean for this purpose. The same cleaning process applies to the heatsink as well. On occasions when I utilized alcohol, I used alcohol pads with a 95% alcohol content.

Following the manufacturer's instructions, I vigorously shake the Nanotherm PCM+ compound. Subsequently, I apply a small, precise amount of the compound onto my CPU die and spread it evenly using a clean applicator. I then proceed to install the heatsink onto the motherboard, making sure not to touch the base or expose it to any contaminants. I am aware that touching the base with my finger is ill-advised.

Approximately one to three weeks later, I removed the Spire cooler to conduct another review, which was when I encountered this perplexing situation. While my CPU die did not exhibit any signs of burning or oxidation, the cooler was noticeably affected. The CPU die imprint showed signs of oxidation, and further oxidation was present between the imprints. It is worth considering that such extensive oxidation would typically result from high temperatures ranging from 100 to 200 degrees Celsius, whereas we were observing temperatures well below 50 degrees Celsius.

Update 2: I am currently awaiting an email from Scott regarding a follow-up on the matter I am about to discuss. Another individual has recently encountered a similar issue when using Nanotherm PCM+ on an SLK HSF (Heat Sink Fan), as evidenced by the attached picture. This suggests that the problem extends beyond my personal experience.

To gather more information, I propose a genuine test. I kindly request individuals who have been using PCM+ for over a week to remove their coolers and assess if they have experienced the same issue. If you come across any signs of oxidation, please email me with details such as the name of your HSF, a picture as evidence, along with information about your CPU and motherboard. My intention is to compile a list of affected coolers. This exclusive information is being shared through Modsynergy.com.

Update 1: Scott and I are currently investigating the root cause of this incident and the subsequent effects. At this point, we do not have a definitive answer. Despite these after-effects, I still hold a positive opinion of PCM+ and intend to continue using it as it remains a superior product. Given that the compound is not expected to cause any such issues, my original review rating stands. Scott has informed me that I am the first individual to report such an incident. For those who may think I am criticizing PCM+, let me clarify that my aim is to share interesting findings with you all. I am presently conducting tests on another cooler to determine if similar issues arise. Therefore, feel free to use PCM+ and acquire it in any quantity you desire.

----

During my preparations for the Thermaltake Silent Boost HSF review, I encountered some concerning after-effects related to the use of this thermal compound. I have several questions for Nanotherm regarding the term "Phase Change" and whether the observed negative consequences are expected or intended. These queries seek clarification and aim to ensure transparency for the public.

Attached are images showcasing the aftermath of using PCM+ on the Spire FalconRock cooler. I have never encountered such issues with other thermal compounds before. It is crucial to determine whether this is an isolated incident or a recurring occurrence.

Observe the copper inlay where the die's imprint is now visible, along with oxidation marks in the center. Other compounds I have used in the past have never resulted in similar effects. Why is this happening specifically with PCM+? Why has this information not been disclosed to the public? Is this a unique situation? These are some questions that need to be addressed by Nanotherm. To ascertain if this is an isolated occurrence, I will proceed to use PCM+ on another cooler and monitor for any similar after-effects. Only after conducting multiple tests on different coolers will I be able to make a final statement.

I want to emphasize that my initial observations should not be taken as a conclusive judgment until further updates unfold. Despite this situation, I want to acknowledge that PCM+ performs exceptionally well and is easy to install. However, if similar issues arise with other coolers I test or if I receive reports from other users, it would be a matter of concern. I have followed the installation instructions provided, applying a small amount of the liquid-like material and spreading it on my die.

I kindly request your patience until I can provide further updates on this matter.