Fanner Group 5F271B1L3 FalconRock II™ HSF Review
A little information about Fanner Group from their website.
”Fanner Group, global supplier of cooling solutions for the personal and networked computer, with it's manufacturing facilities in Shen Zhen, China and offices in The United Kingdom, Germany, The Netherlands, Japan, Taiwan and USA, offers a wide range of thermal products and accessories for the computer industry.”
Fanner Group is also ISO 9002 certified. This ensures every heatsink coming off the assembly line is precisely made for the specifications of different CPU’s.
Wow. My first impressions of this cooler were very positive. From the looks to the design of the cooler. The cooler utilizes a 3-lug clip design. A great move from traditional single-lug clips. It also provides a good bundle. Included is a Spire case badge, a Spire key chain, a pen and a key chain necklace. The heatsink fan itself is covered in plastic to prevent the 80mm fan and the base of the cooler from scratching or being damaged. A very secure package. As you can see, the sink is in the form of a "V", made from all-aluminum. Why aluminum? Why not all copper. I assume it was to save cost and aluminum is a very good heat dissipater too.
A Cooling kit
resistance 0.544 °C/W
25dBA’s is relatively quiet. Also the CFM output on the fan looks weak. Weather this plays a role on temperatures, we will have to find out. The rated speed of the fan is approximately 2300RPM’s. We will see the actual speed later on. Rated power of the fan is 1.08W. So you don’t have to worry about the fan frying your motherboard connector.
Looking at the fan, I must say it looks fabulous in style. It is originally a case fan, just custom made for the HSF. It operates as usual with a 3-pin Molex connector. The whole unit looks massive. The quality build is excellent. Everything’s stable. No loose parts to screw on.
As you can see, pre-applied thermal paste is evident. It will be removed when testing and we will use Arctic Silver 3 for testing. Never use pre-applied thermal paste. Better to use good compounds for better results. FannerTech should revise their thoughts with pre-applied thermal paste.The finish of the base is really good as for the copper inlay also. A little streaky, but overall, a very smooth base.
Results (Toast, UT 2003 Demo, Idle)
There you have it. FannerTech has done a great job. A cooler that is quiet and cools down very good.The toast test is a stress test, and the UT2003 Demo test is more real world. Toast tested it to its limits. If you are looking for a great all around cooler that is future proof along the lines for the new Athlon XP 2800+, you should seriously check this cooler out!
Update: Here are the numbers for this cooler on the Soltek SL-FRN2-L motherboard. Arctic Silver 3 is used. Ambient temps are around 23-25c.
PROS + CONS
+ Good finish on base
+ Nice Bundle
+ 3 Lug-Clip design
+ Did I mention Quiet?
+ Excellent temps!
- Pre-applied thermal grease (not really a con for the average user)
Let me thank Bas and Jeroen from Fanner Group for sending me this sample for review.